Future research aims to explore new computational possibilities through mechanical coupling between memory bits. [2] ...

Malaysia design deal with Arm; strong IC sales; CHIPS Act clawback clause; Allegro spurns offer; TSMC $100B U.S. deal; ...

A new technical paper titled “Efficient and Scalable Post-Layout Optimization for Field-coupled Nanotechnologies” was ...

Thermally Aware Chip Placement with Automatic Differentiation” was published by researchers at MIT and IBM. Abstract ...

Software-defined radar is a case in point. Hardware-agnostic software-defined radars, as it turns out, are one of the key ...

It may not be obvious, but big shifts are underway across the industry that will make it more competitive, strategic, and ...

An open, plug-and-play chiplet ecosystem still faces significant hurdles in interconnect standardization and packaging.

Verify layout integrity, ensure IP placement accuracy, and validate critical symmetry requirements early in the design flow.

New types of wearables and devices can record bodily data or simulate the senses without needing to meet stringent med-tech ...

The increasing complexity of design is driving specialization and innovative approaches in verification — and some ...

To implement a UCIe die-to-die link, designers must address several critical multi-die health challenges, including: ...

Making devices that are defect-free and able to withstand years of harsh environments is made more difficult by a combination ...