Future research aims to explore new computational possibilities through mechanical coupling between memory bits. [2] ...

A new technical paper titled “Efficient and Scalable Post-Layout Optimization for Field-coupled Nanotechnologies” was ...

Malaysia design deal with Arm; strong IC sales; CHIPS Act clawback clause; Allegro spurns offer; TSMC $100B U.S. deal; ...

Thermally Aware Chip Placement with Automatic Differentiation” was published by researchers at MIT and IBM. Abstract ...

Software-defined radar is a case in point. Hardware-agnostic software-defined radars, as it turns out, are one of the key ...

It may not be obvious, but big shifts are underway across the industry that will make it more competitive, strategic, and ...

An open, plug-and-play chiplet ecosystem still faces significant hurdles in interconnect standardization and packaging.

Verify layout integrity, ensure IP placement accuracy, and validate critical symmetry requirements early in the design flow.

New types of wearables and devices can record bodily data or simulate the senses without needing to meet stringent med-tech ...

Acceleration of performance improvements due to AI and disaggregation are driving significant changes at the leading edge of ...

To implement a UCIe die-to-die link, designers must address several critical multi-die health challenges, including: ...

The increasing complexity of design is driving specialization and innovative approaches in verification — and some ...